Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
IEEE1149.1
SoC design gets hierarchical test strategy, improved compression; system design gains end-to-end IJTAG integration strategy
Synopsys automates standards-based hierarchical test insertion and improves test compression for SoCs; Mentor teams with ScanWorks for system-wide IJTAG.
PLATINUM SPONSORS
View All Sponsors