HPC


May 13, 2024

Dense packaging focus for ECTC

This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , , ,   |  Organizations: , , ,
April 29, 2024

Abaco adopts Covid-19 lessons for HPC design

Mil/aero specialist Abaco Systems refined its workflow across multiple design sites after the pandemic constrained collaboration.
June 1, 2023

Semidynamics adds flexible vectors to RISC-V cores

Semidynamics has released a customizable vector unit with out-of-order execution support to accompany its 64bit RISC-V processor cores.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
April 17, 2023

Semidynamics pushes configurability on RISC-V core for HPC

Processor IP company will incorporate custom instructions and other changes in its superscalar core, which includes a novel memory unit for sparse matrices.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: ,
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.

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