Tech Design Forum
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5D
5D
September 27, 2022
Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
Article | Topics:
EDA - DFT
| Tags:
2.5D
,
3D
,
5D
,
chiplet
,
IEEE1149.1
,
IEEE1687
,
IEEE1838
,
interconnect
,
interposer
,
stacked die
,
TSV
| Organizations:
Siemens EDA
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