Chipletz

November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.

Article | Topics: Case Study, Next Generation Design, Packaging, Blog - PCB, - Physical design | Tags: AI, chiplets, HPC, interposer, metaverse, substrate, system-in-package | Organizations: Chipletz, Siemens EDA

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