July 8, 2020
In a panel session at VLSI Symposia, AMD described how the economics have come down strongly in favor of multichip integration for multicore server processors.
April 5, 2018
PDK enables photonics prototyping on MPW runs and compatibility with volume production at STMicroelectronics at Crolles.
March 27, 2014
Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
November 7, 2013
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
November 4, 2013
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
March 19, 2013
The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.
December 13, 2012
3D-IC integration techniques such as the use of TSVs, die stacking and interposers are unlikely to limit performance, according to research from TSMC and IBM
March 26, 2012
At the SNUG event this week, Synopsys is taking the wraps off its plans to support 3DIC, with updates to tools for physical design and verification.