ETRI builds flow for AI chiplets
South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
interposer
Chipletz pushes packaging design for AI, HPC and immersive use-cases
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
Capturing connectivity for assembly verification in 2.5D and 3D design
Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
How digital twin evaluations optimize STCO-based design
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
Choose the right advanced packaging methodology for metal fill rules
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
Scaling costs tip balance toward chiplets for AMD server processors
In a panel session at VLSI Symposia, AMD described how the economics have come down strongly in favor of multichip integration for multicore server processors.
Leti releases photonics design kit for Synopsys PhoeniX OptoDesigner suite
PDK enables photonics prototyping on MPW runs and compatibility with volume production at STMicroelectronics at Crolles.
Intel and Altera extend foundry deal into interposer and full 3D
Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
TSMC demonstrates readiness for 3D-IC
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.