Research Groups

October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
July 5, 2019
ES Design West logo

The road to ES Design West: Design Pavilion

ES Design West aims to help integrate the supply chain but also has plenty of engineering content aimed at low power, security, embedded and more.
July 3, 2019
IBM Q

Roadmapping the quantum realm

The US Quantum Economic Development Consortium is looking to stimulate a supply chain and technology infrastructure for quantum computing, with more about its efforts due to come out in the next few days.
July 2, 2019

The road to ES Design West: Location, location, location

There's still plenty of time to build a busy and profitable agenda for a visit to ES Design West and SEMICON West in San Francisco next week.
June 4, 2019

The unknown unknowns of secure devices

Developing a security assurance standard for IP faces numerous problems but Accellera working-group members are trying to find an answer.
April 9, 2019

DAC announces first set of keynotes for 2019

Electronic musician Thomas Dolby will be among the keynote speakers at the 56th Design Automation Conference (DAC) in Las Vegas.
January 31, 2019

Creating a $4B market for silicon photonics

It's been a long time coming, but silicon photonics is now entering commercial design for networking and grabbing attention in autonomous driving and sensors.
Article  |  Topics: Blog Topics  |  Tags: , , , ,   |  Organizations: , , , ,
December 12, 2018

IEDM shows progress on embedded eMRAM

Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: , , ,
December 5, 2018

Leti takes the heat off monolithic 3D

CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
October 22, 2018

IEDM to examine scaling from multiple directions

CMOS moving to 3nm and DRAM going beyond 20nm scaling are two of the late papers at the upcoming IEDM and part of a larger examination of semiconductor trends.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,

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