3nm


August 25, 2020

TSMC fills in sub-nodes as EUV gains ground

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: ,
June 24, 2020

IEDM switches to virtual format for 2020

The organizers of the 66th annual IEDM have decided to hold the December conference virtually.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,
June 16, 2020

Transistor stacks piled high at VLSI

As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , , , , , ,   |  Organizations: ,
June 15, 2020

EDA in the cloud boosts DRC iterations for AMD

AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
Article  |  Topics: Blog Topics  |  Tags: , , , , , , , , ,   |  Organizations: , , ,
September 4, 2019

IEDM homes in on connected devices

The IEDM has chosen a theme based around technologies for connected devices for its upcoming conference in December.
Article  |  Topics: Blog - EDA  |  Tags: , , ,
October 22, 2018

IEDM to examine scaling from multiple directions

CMOS moving to 3nm and DRAM going beyond 20nm scaling are two of the late papers at the upcoming IEDM and part of a larger examination of semiconductor trends.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
June 22, 2018

Imec stacks transistors for denser 3nm option

Imec proposes using stacked CMOS transistors and buried power rails to improve density for the 3nm process node.
Article  |  Topics: Blog Topics  |  Tags: , , , , ,   |  Organizations:
February 28, 2018

Cadence and Imec tape out 3nm interconnect test chip

Cadence and Imec have worked together on a project to tape out a test chip to explore manufacturing and design-rule options for the interconnect on future 3nm processes.
February 16, 2018

SPIE Advanced Lithography 2018 preview: Mentor

Innovation and advances in EUV and OPC lead Mentor's offerings at SPIE in San Jose later this month.
Article  |  Topics: Conferences, Design to Silicon  |  Tags: , , , , , , ,   |  Organizations: ,
June 20, 2016

DTCO points to sub-10nm optimizations

DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , , , ,   |  Organizations: ,

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