DARPA


July 5, 2019
ES Design West logo

The road to ES Design West: Design Pavilion

ES Design West aims to help integrate the supply chain but also has plenty of engineering content aimed at low power, security, embedded and more.
June 4, 2019

The unknown unknowns of secure devices

Developing a security assurance standard for IP faces numerous problems but Accellera working-group members are trying to find an answer.
April 9, 2019

DAC announces first set of keynotes for 2019

Electronic musician Thomas Dolby will be among the keynote speakers at the 56th Design Automation Conference (DAC) in Las Vegas.
June 27, 2018

Remember the design gap? It’s back

Fifteen years on from the design gap that triggered the IP revolution, implementation costs have created a new one.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations: , ,
April 10, 2013

3D-IC cooling ascends the agenda

US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: ,   |  Organizations: , ,

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