Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
Synopsys and GLOBALFOUNDRIES are developing a portfolio of automotive IP for the chipmaker’s 22nm fully depleted silicon-on-insulator (22FDX) process.
Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.
Foundry claims isolation and device integration advantages for 180nm SOI process, help to absorb extra costs of SOI wafers
Cabling and its weight are helping to drive integration and a shift towards wireless communication within cars, says NXP's automotive CTO.
Taking place in Chelmsford, MA on 27 August, the conference will feature user-authored papers, tutorials, a designer expo and keynotes from Cadence and IBM.
Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
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