SOI


July 11, 2018

Leti and Soitec partner for wafer development

Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
June 25, 2015

X-Fab updates 180nm SOI process for automotive and industrial applications

Foundry claims isolation and device integration advantages for 180nm SOI process, help to absorb extra costs of SOI wafers
Article  |  Topics: Blog - EDA, - Product  |  Tags: , , , , ,   |  Organizations:
April 29, 2015

Automotive integration led by cabling concerns, says NXP

Cabling and its weight are helping to drive integration and a shift towards wireless communication within cars, says NXP's automotive CTO.
August 12, 2013

CDNLive Boston to tackle mixed-signal design, host exhibit

Taking place in Chelmsford, MA on 27 August, the conference will feature user-authored papers, tutorials, a designer expo and keynotes from Cadence and IBM.
October 15, 2012

FinFETs face planar fightback at IEDM

Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
Article  |  Topics: Commentary, Conferences, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,

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