October 14, 2019
Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
October 3, 2019
Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
April 12, 2019
Synopsys and GLOBALFOUNDRIES are developing a portfolio of automotive IP for the chipmaker’s 22nm fully depleted silicon-on-insulator (22FDX) process.
July 11, 2018
Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.
June 25, 2015
Foundry claims isolation and device integration advantages for 180nm SOI process, help to absorb extra costs of SOI wafers
April 29, 2015
Cabling and its weight are helping to drive integration and a shift towards wireless communication within cars, says NXP's automotive CTO.
August 12, 2013
Taking place in Chelmsford, MA on 27 August, the conference will feature user-authored papers, tutorials, a designer expo and keynotes from Cadence and IBM.
October 15, 2012
Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM