From tutorials to technical papers to special 'diamond' sessions, Tessent features large at ITC 2023.
A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.
TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
Arm is among a group of automotive OEMs and component suppliers who have set up a consortium to try to coordinate the development of autonomous-vehicle electronics.
Safety verification calls for increased collaboration across the supply chain, experts say. The challenge is finding ways to make that happen.
ES Design West aims to help integrate the supply chain but also has plenty of engineering content aimed at low power, security, embedded and more.
Mentor is active across the program and its main and Verification Academy booths within the exhibition in Las Vegas.
Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
The major verification conference is looming and Mentor's participation will include tutorials that explore the latest in portable stimulus, SystemC, VIP and more.
NXP discusses second silicon flavor for automotive radar, after earlier launch of postage-stamp devices.
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