artificial intelligence

February 12, 2020

AI processor company opts for Analog FASTSPICE and Symphony

Mythic will use the Mentor tools for its analog-targeted intelligence processing units.
December 16, 2019

Mentor delivers eMRAM test for ARM/Samsung FDSOI at 28nm

Tessent test suite targets automotive, AI and IoT projects that need embedded non-volatile memory.
September 3, 2019
Joe Sawicki, EVP for IC EDA, Mentor. 'AI inside' analysis

EDA with ‘AI inside’ – Mentor’s Joe Sawicki offers an insider’s view

Mentor has a host of tools - some public, some not - that leverage AI and ML. EVP Joe Sawicki has been describing the strategy behind their development.
August 23, 2019

Making the case for HLS in autonomous drive

The automotive market faces challenges that make it a prime candidate for the greater use of high-level synthesis on designs with AI and ML content.
July 3, 2019
IBM Q

Roadmapping the quantum realm

The US Quantum Economic Development Consortium is looking to stimulate a supply chain and technology infrastructure for quantum computing, with more about its efforts due to come out in the next few days.
July 2, 2019

Verifying in an HLS context for AI and ML designs

A SystemC/C++ app from a library that extends the OneSpin 360 DV-Verify platform was used by ML IP specialist NanoSemi on a 5G/WiFi project.
June 27, 2019

Building an ecosystem around HLS for AI and ML designs

Mentor's AI Accelerator Ecosystem adds reference designs, libraries and other forms of support around its Catapult HLS platform.
June 13, 2019

The road to ES Design West: AI

AI, its system design implications and its impact on EDA tools themselves will be a key theme for ES Design West next month.
May 28, 2019

ARM adds Cortex-A77 and Mali-G77 cores for 5G and ML

The company is also bundling its new CPU and GPU cores in a premium IP platform that can be tuned for next generation applications and devices.
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May 23, 2019

AI and ML fuel Catapult and Calibre updates

Mentor takes the wraps off new machine learning fueled features in its HLS and physical design families ahead of DAC 2019.

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