IBM

Collaboration on DTCO offers IBM a better way to evaluate combinations of transistor architectures, materials and other process technology innovations using design metrics, before real wafers become available for physical experimentation.

Fifteen years on from the design gap that triggered the IP revolution, implementation costs have created a new one.

DAC in June will feature a series of keynotes and technical sessions on machine learning and AI for both target applications and in the design process itself.

Among the papers at this year's VLSI Symposia in Hawaii in June, Samsung will describe a 7nm CMOS process that uses EUV lithography to tighten up device features on minimum-pitch interconnects.

“It’s the time between putting out an open-source ARM core and getting a letter from an ARM lawyer,” says UC Berkeley professor Krste Asanovic. So, some design teams are turning to IP that started out as open source to provide more scope for experimentation.

Design for test could look quite different in five years' time compared to the situation designers have today as chipmakers wrestle with the problems of yield control, safety, and aging.

The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.

Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.

IBM to offer end-to-end IC design flow on its own infrastructure in PAYG EDA model.