IBM

This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.

In a panel at this week’s DVCon Europe, experts described a number of issues facing teams looking to incorporate machine learning in logic verification flows and why some of those efforts will not pay off while others succeed.

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.

The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.

Adaptive power-aware clocking and buried rails are among the techniques to be explored at the 2020 VLSI Symposia.

The US Quantum Economic Development Consortium is looking to stimulate a supply chain and technology infrastructure for quantum computing, with more about its efforts due to come out in the next few days.

The verification IP is the first to become commercially available for the bus interface backed by companies such as AMD, Google, IBM, Micron and Xilinx.

AI, its system design implications and its impact on EDA tools themselves will be a key theme for ES Design West next month.

Collaboration on DTCO offers IBM a better way to evaluate combinations of transistor architectures, materials and other process technology innovations using design metrics, before real wafers become available for physical experimentation.