IBM

July 13, 2020

Heterogeneous integration calls for new approaches

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , ,   |  Organizations: , ,
May 26, 2020

Nanometer scaling puts focus on power at VLSI in June

Adaptive power-aware clocking and buried rails are among the techniques to be explored at the 2020 VLSI Symposia.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , , ,
July 3, 2019
IBM Q

Roadmapping the quantum realm

The US Quantum Economic Development Consortium is looking to stimulate a supply chain and technology infrastructure for quantum computing, with more about its efforts due to come out in the next few days.
July 2, 2019

SmartDV adds verification IP for OpenCAPI data-center standard

The verification IP is the first to become commercially available for the bus interface backed by companies such as AMD, Google, IBM, Micron and Xilinx.
June 13, 2019

The road to ES Design West: AI

AI, its system design implications and its impact on EDA tools themselves will be a key theme for ES Design West next month.
August 16, 2018

IBM and Synopsys to apply DTCO to post-finFET process development

Collaboration on DTCO offers IBM a better way to evaluate combinations of transistor architectures, materials and other process technology innovations using design metrics, before real wafers become available for physical experimentation.
June 27, 2018

Remember the design gap? It’s back

Fifteen years on from the design gap that triggered the IP revolution, implementation costs have created a new one.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations: , ,
April 9, 2018

DAC keynotes and sessions aim for AI

DAC in June will feature a series of keynotes and technical sessions on machine learning and AI for both target applications and in the design process itself.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , , ,
May 12, 2017

Advanced processes feature at VLSI in June

Among the papers at this year's VLSI Symposia in Hawaii in June, Samsung will describe a 7nm CMOS process that uses EUV lithography to tighten up device features on minimum-pitch interconnects.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , ,
June 12, 2016

What’s the shortest time in the universe?

“It’s the time between putting out an open-source ARM core and getting a letter from an ARM lawyer,” says UC Berkeley professor Krste Asanovic. So, some design teams are turning to IP that started out as open source to provide more scope for experimentation.

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