device scaling


June 3, 2021

Three libraries tune speed and density on TSMC’s 3nm process

TSMC will provide three different standard-cell libraries for its upcoming finFET-based 3nm process to cover requirements from high-density mobile to high-performance computing, allowing tradeoffs for area and circuit frequency.
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May 2, 2021

Alternative scaling approaches form VLSI 2021 technology highlights

The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
November 9, 2020

IEDM 2020 highlights transistor and interconnect advances

This year's IEDM will feature papers that exploit stacked nanoribbons to reduce CMOS footprint, graphene interconnects that support easier integration, and the variability prospects of 2D semiconductors.
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July 21, 2020

3D integration technologies will blend says TSMC chief scientist

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
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July 2, 2019

The road to ES Design West: Location, location, location

There's still plenty of time to build a busy and profitable agenda for a visit to ES Design West and SEMICON West in San Francisco next week.
May 15, 2017

IEDM opts for later deadline on 63rd conference

The 63rd IEDM has issued a call for papers for its conference in San Francisco in early December and has stuck with the later deadline introduced last year.
December 16, 2013

Qualcomm’s take on preserving Moore’s Law economics

Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
October 4, 2013

Design kit for 10nm FD-SOI due out next year

Research group CEA-Leti expects to have design kits ready for a 10nm FD-SOI process in June 2014
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