There's still plenty of time to build a busy and profitable agenda for a visit to ES Design West and SEMICON West in San Francisco next week.
Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
Imec and Unisantis Electronics have developed a process flow based on a vertical transistor with a gate on all sides they claim will lead to denser memories on a 5nm node.
IEDM has issued a call for papers for its 2018 conference, expecting to cover devices and circuit interactions in neuromorphic, quantum and conventional computing.
Cadence Design Systems has made enhancements to its Virtuoso mixed-signal layout tool at both the system-level and nanometer-design levels for its 18.1 release.
LSG generates random design-like test vehicles to enable more detailed pre-ramp analysis for incoming nodes.
Innovation and advances in EUV and OPC lead Mentor's offerings at SPIE in San Jose later this month.
The 63rd IEDM has issued a call for papers for its conference in San Francisco in early December and has stuck with the later deadline introduced last year.
DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.
IMEC and Cadence have taped out a test chip intended to explore key lithography and metal-interconnect issues that will face users of the forthcoming 5nm process node.
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