The choices for heterogeneous integration are falling into three main families, demonstrated by A*Star at IEDM 2022.
Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.
AI, its system design implications and its impact on EDA tools themselves will be a key theme for ES Design West next month.
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