Purdue University

December 18, 2020

Backside metal defends against IR drop and side-channel attacks

Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.

Article | Topics: Blog - EDA | Tags: design for security, IEDM 2020, IR drop, power grid, side-channel analysis | Organizations: Georgia Tech, Intel, Kobe University, Purdue University

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