Alternative scaling approaches form VLSI 2021 technology highlights
The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
Purdue University
Backside metal defends against IR drop and side-channel attacks
Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.
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