Tsinghua University

October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.

Article | Topics: Blog - EDA | Tags: 3DIC, buried power rails, IEDM 2021, monolithic 3DIC, nanosheet, ReRAM | Organizations: IBM, IMEC, Samsung Electronics, Tsinghua University

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