Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
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