advanced packaging

April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.

Article | Topics: Blog Topics | Tags: advanced packaging, CDX, chiplet, ecosystem, heterogenous, OCP, ODSA, SIP, standards | Organizations: Cameron EDA, Chip Design Exchange, Palo Alto Electron, Siemens EDA, Thrace Systems

February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.

Article | Topics: Verification | Tags: 2.5D, 3D, advanced packaging, assembly, chiplet, connectivity, foundry, integration, interposer, OSAT | Organizations: Siemens EDA

January 25, 2022

Choose the right advanced packaging methodology for metal fill rules

Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.

Article | Topics: DFM, Blog - EDA, - Verification | Tags: 3D, advanced packaging, design rules, EMI, foundry, HBM, high-bandwidth memory, interposer, OSAT, power integrity, signal integrity | Organizations: Siemens EDA

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