Dense packaging focus for ECTC
This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.
advanced packaging
Does 2.5DIC call for IC design tools for the packaging?
Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
Go inside proposals for common chiplet models
Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
Capturing connectivity for assembly verification in 2.5D and 3D design
Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
Choose the right advanced packaging methodology for metal fill rules
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.