packaging


June 13, 2019

The road to ES Design West: AI

AI, its system design implications and its impact on EDA tools themselves will be a key theme for ES Design West next month.
March 24, 2015

Mentor unites chip-to-package flow with Xpedition Package Integrator

Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.
November 4, 2013

Amkor keeps question mark next to ‘full’ 3D-IC in 2016

Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
April 1, 2013

DAC 2013 Preview I: Putting users first and marking 50 years

In the first of our weekly DAC 2013 previews, we discuss program highlights with general chair Yervant Zorian, including an expanded Designer Track, keynotes and golden jubilee celebrations.

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