This year’s IEDM features a number of papers that seek to drive down the size and boost the performance of image sensors.
Ferroelectric memory may be able to stage a comeback thanks to materials innovations as work presented at VLSI Symposium have shown, though there is still plenty to do.
VLSI Symposium 2022 will show the rapid development taking place in oxide-based replacements for traditional DRAM cells as well as the emerging area of memory-based low-power machine learning.
The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.
It’s the back-end that needs work as system-level considerations begin to dominate design, Qualcomm’s vice president of engineering said at DAC.
The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.
Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
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