2.5DIC

A Siemens white paper describes a way of automatically deriving information from 2.5D/3DIC designs to streamline latchup design-rules verification.

The added complexity of managing reliability as chiplet-based designs become more common will need to be managed using digital-twin techniques, says a professor working in the field.

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.

In a panel session at VLSI Symposia, AMD described how the economics have come down strongly in favor of multichip integration for multicore server processors.

Mentor will be present throughout the DAC program but with a particular focus on machine learning, artificial intelligence and automotive challenges.

Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.

Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits.

Altera is using a combination of Intel's 14nm process technology and multidie packaging to boost the logic-cell count for its FPGAs, together with a superpipelining strategy to help balance area and clock speed.

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.

The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.