buried power rails


July 24, 2023

Backside power shows promise but more complex manufacturing

Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , ,
April 13, 2023

Arm signs sub-2nm deal with Intel foundry operation

Intel Foundry Services has signed a deal with Arm that will see the two companies work on a program of system and design-technology co-optimization.
Article  |  Topics: Blog - IP  |  Tags: , , , , , ,   |  Organizations: ,
October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , , ,

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