buried power rails

Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.

Intel Foundry Services has signed a deal with Arm that will see the two companies work on a program of system and design-technology co-optimization.

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.