IBM

April 9, 2018

DAC keynotes and sessions aim for AI

DAC in June will feature a series of keynotes and technical sessions on machine learning and AI for both target applications and in the design process itself.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , , ,
May 12, 2017

Advanced processes feature at VLSI in June

Among the papers at this year's VLSI Symposia in Hawaii in June, Samsung will describe a 7nm CMOS process that uses EUV lithography to tighten up device features on minimum-pitch interconnects.
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June 12, 2016

What’s the shortest time in the universe?

“It’s the time between putting out an open-source ARM core and getting a letter from an ARM lawyer,” says UC Berkeley professor Krste Asanovic. So, some design teams are turning to IP that started out as open source to provide more scope for experimentation.
June 10, 2016

DFT to expand its role for long-term yield

Design for test could look quite different in five years' time compared to the situation designers have today as chipmakers wrestle with the problems of yield control, safety, and aging.
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February 11, 2016

SPIE Advanced Lithography Preview: Mentor Graphics

The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.
July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
June 18, 2015

The road to 7nm sees patterning multiply

Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , ,
June 7, 2015

IBM plans to disrupt EDA market with cloud offering

IBM to offer end-to-end IC design flow on its own infrastructure in PAYG EDA model.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations: ,
May 11, 2015

VLSI Symposia delve into future process choices

Intel 14nm finFET SoC process is among the highlights of the 2015 VLSI Symposia alongside research that looks at the integration of III-V and 2D materials for future processes.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , , ,
March 17, 2015

China’s foundry outlook improves but still much to do

Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , , ,   |  Organizations: , , , ,

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