Mentor, a Siemens business, plans to expand the team working on the Aprisa place-and-route tool following the purchase of Avatar Integrated Systems, announced in July.
DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
Collaboration on DTCO offers IBM a better way to evaluate combinations of transistor architectures, materials and other process technology innovations using design metrics, before real wafers become available for physical experimentation.
Imec proposes using stacked CMOS transistors and buried power rails to improve density for the 3nm process node.
At VLSI Symposia 2018, GlobalFoundries researchers proposed looking at the metal-gate ‘gear’ ratio as a way of improving the routability of standard cells.
Samsung Electronics expects to increase savings on die area in the shift from its 10nm to 7nm node by applying both EUV for critical layers and several layout-focused process changes.
Imec and Unisantis Electronics have developed a process flow based on a vertical transistor with a gate on all sides they claim will lead to denser memories on a 5nm node.
The International Electron Device Meeting has pushed back the deadline for its papers to get the latest developments in process and device design into the December conference.
DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.
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