Foundry

October 29, 2019

Foundries call off patent war

GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
Article  |  Topics: Blog - EDA, IP  |  Tags: ,   |  Organizations: ,
October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
October 3, 2019

X-Fab expands MPW access through Europractice

Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
August 27, 2019

GlobalFoundries takes aim at TSMC’s customers in patent action

GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations: , , ,
August 15, 2019

Optimized DRC in the cloud

A new whitepaper describes some of the techniques you can use to get the most out of cloud-based DRC with Calibre.
July 3, 2019

How to automate pre-tape-out ESD protection verification

A new paper describes an alternative to increasingly inefficient manual ESD verification that reduces risks of respins and missed delivery deadlines.
Article  |  Topics: Design to Silicon, Blog - EDA, - Technical Articles, Verification  |  Tags: , ,   |  Organizations: ,
June 6, 2019

Calibre scales to 4000 nodes for faster sign off in the cloud

AMD used Calibre with optimisations implemented for cloud support to slash runtimes on high-end server processor designs.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations: , , ,
April 22, 2019

Machine learning and chiplets headline VLSI Symposia

Large-scale MCMs and novel device architectures bookend the papers on machine learning at VLSI Symposia in an event that will also cover chiplet integration and other topics.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: , ,
April 18, 2019

User2User Silicon Valley is two weeks away

Mentor's technical conference will take place on May 2 at the Santa Clara Marriott and feature more than 45 user and vendor presentations.
April 4, 2019

ODSA weighs options for chiplet interconnect

An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.

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