Foundry

August 25, 2020

TSMC fills in sub-nodes as EUV gains ground

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: ,
July 29, 2020

Litho hotspot analysis gets machine-learning turbocharge

A Mentor-Samsung collaboration cuts the need for model-based analysis and speeds analysis runtime by as much as 20X.
Article  |  Topics: Case Study, Conferences, Design to Silicon  |  Tags: , , , ,   |  Organizations: , ,
July 21, 2020

3D integration technologies will blend says TSMC chief scientist

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
June 15, 2020

EDA in the cloud boosts DRC iterations for AMD

AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
Article  |  Topics: Blog Topics  |  Tags: , , , , , , , , ,   |  Organizations: , , ,
January 10, 2020

MRAM pushes speed and endurance at IEDM

IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: , , ,
December 16, 2019

Mentor delivers eMRAM test for ARM/Samsung FDSOI at 28nm

Tessent test suite targets automotive, AI and IoT projects that need embedded non-volatile memory.
October 29, 2019

Foundries call off patent war

GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
Article  |  Topics: Blog - EDA, IP  |  Tags: ,   |  Organizations: ,
October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
October 3, 2019

X-Fab expands MPW access through Europractice

Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
August 27, 2019

GlobalFoundries takes aim at TSMC’s customers in patent action

GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations: , , ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors