Foundry

June 4, 2021

TSMC spins outs processes for automotive and RF

TSMC is developing processes for high-end automotive and RF based off its N5 and N7 families.
Article  |  Topics: Blog Topics  |  Tags: , , , , , ,   |  Organizations:
June 3, 2021

Three libraries tune speed and density on TSMC’s 3nm process

TSMC will provide three different standard-cell libraries for its upcoming finFET-based 3nm process to cover requirements from high-density mobile to high-performance computing, allowing tradeoffs for area and circuit frequency.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations:
January 15, 2021

Copper’s future is troubled but it’s likely to stick around

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , , ,
August 25, 2020

TSMC fills in sub-nodes as EUV gains ground

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: ,
July 29, 2020

Litho hotspot analysis gets machine-learning turbocharge

A Mentor-Samsung collaboration cuts the need for model-based analysis and speeds analysis runtime by as much as 20X.
July 21, 2020

3D integration technologies will blend says TSMC chief scientist

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
June 15, 2020

EDA in the cloud boosts DRC iterations for AMD

AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
Article  |  Topics: Blog Topics  |  Tags: , , , , , , , , ,   |  Organizations: , , ,
January 10, 2020

MRAM pushes speed and endurance at IEDM

IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: , , ,
December 16, 2019

Mentor delivers eMRAM test for ARM/Samsung FDSOI at 28nm

Tessent test suite targets automotive, AI and IoT projects that need embedded non-volatile memory.
October 29, 2019

Foundries call off patent war

GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
Article  |  Topics: Blog - EDA, IP  |  Tags: ,   |  Organizations: ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors