The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
A Mentor-Samsung collaboration cuts the need for model-based analysis and speeds analysis runtime by as much as 20X.
DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
Tessent test suite targets automotive, AI and IoT projects that need embedded non-volatile memory.
GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
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