Foundry

This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.

The flat nature of traditional IC packaging design struggles to cope with the chiplet era. Homogeneous disaggregation offers an alternative.

Vertical integration is one of the major focus areas at the upcoming IEDM conference, both in terms of transistors and the multiple channels that will go into them.

X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.

Nvidia's move into software aimed at mask production and EDA looks to be part of a wider shift to improve yields.

At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.

TSMC calls for modular EDA flows and increased use of hierarchical verification to support complex 3DIC designs.

TSMC is developing processes for high-end automotive and RF based off its N5 and N7 families.

TSMC will provide three different standard-cell libraries for its upcoming finFET-based 3nm process to cover requirements from high-density mobile to high-performance computing, allowing tradeoffs for area and circuit frequency.

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.