Foundry

Xilinx plans to add high-speed analog interfaces to its upcoming FPGAs to better support high-density 5G basestation designs.

The major West Coast technical conference for lithography is just two weeks away and offers a packed agenda.

What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.

What will 3D integration look like? IEDM 2016 explored some of the options ranging from IoT sensors to advanced logic.

A licensing deal with GlobalFoundries has provided chipmaker Aquantia with the ability to speed up development of a 100Gbit/s link technology for data centers.

GlobalFoundries has introduced an embedded-MRAM option for its 22nm FD-SOI process: the 22FDX platform.

DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.

ARM says it has received test chips designed to check how well an SoC built around a 64bit multicore Cortex v8-A processor complex would work TSMC's upcoming 10nm FinFET process technology.

But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.

The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.