Foundry

May 18, 2016

ARM completes multicore test chip on 10nm finFET

ARM says it has received test chips designed to check how well an SoC built around a 64bit multicore Cortex v8-A processor complex would work TSMC's upcoming 10nm FinFET process technology.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: ,
April 7, 2016

SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley

But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
February 11, 2016

SPIE Advanced Lithography Preview: Mentor Graphics

The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.
October 22, 2015

Ceva builds DSP chip and board for IoT prototyping

IP supplier CEVA has made a development platform intended to speed up the prototyping of IoT and similar devices based on its TeakLite-4 DSP core.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , ,   |  Organizations: ,
September 14, 2015

Menta aims for TSMC 28nm with embedded FPGA cores

Menta has launched a family of off-the-shelf IP cores aimed at TSMC’s 28nm processes to provide reconfigurability for SoCs.
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations: ,
July 30, 2015

10nm flow reveals complexity of finFET design process

Collaboration between ARM, TSMC and Synopsys reveals challenges of 10nm finFET design flows.
Article  |  Topics: Conferences, Design to Silicon, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , ,
July 13, 2015

GlobalFoundries tunes 28nm for smaller, lower-power FD-SOI

GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
June 4, 2015

COMPUTEX 2015: Taiwan and mainland China face off in IoT platforms

It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.

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