January 4, 2023
The choices for heterogeneous integration are falling into three main families, demonstrated by A*Star at IEDM 2022.
December 9, 2022
Adding an MOL layer that takes advantage of a self-aligned pitch-splitting technique and a rotated layout could cut standard-cell height to 4T.
December 5, 2022
Imec has developed a high-endurance ferroelectric capacitor that could form the basis of storag-class embedded and standalone memories.
October 17, 2022
At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.