The choices for heterogeneous integration are falling into three main families, demonstrated by A*Star at IEDM 2022.
Adding an MOL layer that takes advantage of a self-aligned pitch-splitting technique and a rotated layout could cut standard-cell height to 4T.
Imec has developed a high-endurance ferroelectric capacitor that could form the basis of storag-class embedded and standalone memories.
At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
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