thermal simulation


June 17, 2021

Standard arrives for thermal simulation data

A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.
September 18, 2019

Cadence expands system analysis to thermal

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
Article  |  Topics: Blog - EDA, PCB  |  Tags: ,   |  Organizations:
May 12, 2017

Toshiba case study describes advanced thermal simulation

Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.

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