thermal simulation


July 12, 2022

Cadence buys thermal software for data-center digital twins

Thermal-simulation specialist Future Facilities has agreed to be acquired by Cadence Design Systems.
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June 20, 2022

3DIC design needs more hierarchy, TSMC says

TSMC calls for modular EDA flows and increased use of hierarchical verification to support complex 3DIC designs.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
June 17, 2021

Standard arrives for thermal simulation data

A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.
September 18, 2019

Cadence expands system analysis to thermal

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
Article  |  Topics: Blog - EDA, PCB  |  Tags: ,   |  Organizations:
May 12, 2017

Toshiba case study describes advanced thermal simulation

Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.

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