October 17, 2022
At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
July 12, 2022
Thermal-simulation specialist Future Facilities has agreed to be acquired by Cadence Design Systems.
June 20, 2022
TSMC calls for modular EDA flows and increased use of hierarchical verification to support complex 3DIC designs.
June 17, 2021
A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.
September 18, 2019
Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
May 12, 2017
Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.