At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
Thermal-simulation specialist Future Facilities has agreed to be acquired by Cadence Design Systems.
TSMC calls for modular EDA flows and increased use of hierarchical verification to support complex 3DIC designs.
A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.
Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.
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