At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
The 63rd IEDM has issued a call for papers for its conference in San Francisco in early December and has stuck with the later deadline introduced last year.
Intel 14nm finFET SoC process is among the highlights of the 2015 VLSI Symposia alongside research that looks at the integration of III-V and 2D materials for future processes.
A research-focused session at DAC 2014 looks at using coupled oscillators rather than charge transfer to process data.
MEMS relay-based devices offer the ultimate in subthreshold leakage: they don't have any. Design and technology advances are promising to overcome problems with reliability, design and speed, according to Tsu-Jae King Liu of UC Berkeley.
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