post-CMOS devices


May 15, 2017

IEDM opts for later deadline on 63rd conference

The 63rd IEDM has issued a call for papers for its conference in San Francisco in early December and has stuck with the later deadline introduced last year.
May 11, 2015

VLSI Symposia delve into future process choices

Intel 14nm finFET SoC process is among the highlights of the 2015 VLSI Symposia alongside research that looks at the integration of III-V and 2D materials for future processes.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , , ,
June 2, 2014

Post-silicon devices: maybe it’s in the way they move

A research-focused session at DAC 2014 looks at using coupled oscillators rather than charge transfer to process data.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
June 13, 2012

Low-power logic for steampunks

MEMS relay-based devices offer the ultimate in subthreshold leakage: they don't have any. Design and technology advances are promising to overcome problems with reliability, design and speed, according to Tsu-Jae King Liu of UC Berkeley.

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