Intel talks 4 at VLSI
Intel expects to double logic density through metal scaling and smaller cells with upcoming process.
VLSI 2022
3DIC design needs more hierarchy, TSMC says
TSMC calls for modular EDA flows and increased use of hierarchical verification to support complex 3DIC designs.
Oxide DRAM gains traction at VLSI Symposium
VLSI Symposium 2022 will show the rapid development taking place in oxide-based replacements for traditional DRAM cells as well as the emerging area of memory-based low-power machine learning.
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