July 21, 2020
DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
June 15, 2020
AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
January 10, 2020
IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
December 16, 2019
Tessent test suite targets automotive, AI and IoT projects that need embedded non-volatile memory.
October 29, 2019
GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
October 14, 2019
Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
October 3, 2019
Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
August 27, 2019
GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
August 15, 2019
A new whitepaper describes some of the techniques you can use to get the most out of cloud-based DRC with Calibre.
July 3, 2019
A new paper describes an alternative to increasingly inefficient manual ESD verification that reduces risks of respins and missed delivery deadlines.