AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.
Teledyne e2v has demonstrated a prototype optical link that the company believes could replace electrical signaling for remote RF heads.
Recognizing the 75th anniversary of the transistor in December, the 68th IEDM has taken on the theme of looking at “transformative devices to address global challenges”.
TSMC is developing processes for high-end automotive and RF based off its N5 and N7 families.
An RF Laboratories engineer provides some tips and techniques in the context of the PADS Professional suite.
A white paper details the parasitic extraction technology needed to help design high-performance RF SoCs.
GlobalFoundries has decided to put development of its 7nm process on the backburner and focus on its existing finFET and FD-SOI processes.
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.
Slovenian startup Red Pitaya has added a front-end module and firmware to its FPGA-based StemLab board to create a customizable vector network analyzer (VNA) and RF tester.
View All Sponsors