IEDM call for papers looks for tomorrow’s semiconductors
The 70th annual IEDM is putting together its next conference under the theme under the theme “shaping tomorrow’s semiconductor technology”.
RF
Air-filled waveguides to cut losses in mass-market radar
AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.
Teledyne pushes for optical for remote RF heads
Teledyne e2v has demonstrated a prototype optical link that the company believes could replace electrical signaling for remote RF heads.
IEDM to celebrate 75 years of the transistor
Recognizing the 75th anniversary of the transistor in December, the 68th IEDM has taken on the theme of looking at “transformative devices to address global challenges”.
TSMC spins outs processes for automotive and RF
TSMC is developing processes for high-end automotive and RF based off its N5 and N7 families.
How to handle PCB constraints for IoT designs
An RF Laboratories engineer provides some tips and techniques in the context of the PADS Professional suite.
Parasitic extraction to guide capacitor usage in RF SoCs
A white paper details the parasitic extraction technology needed to help design high-performance RF SoCs.
GlobalFoundries stops 7nm work to focus on existing processes
GlobalFoundries has decided to put development of its 7nm process on the backburner and focus on its existing finFET and FD-SOI processes.
With RF, power and MRAM, FD-SOI finds its role
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
SAR-VCO combo tunes RF receiver power on 16nm
Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.