Node-variant FinFET tweaks try to improve cost, performance
Foundries have taken aim at standard-cell track height and design-rule tweaks to try to improve the area efficiency and performance of derivative finFET processes.
standard cell
Cadence and Imec tape out 3nm interconnect test chip
Cadence and Imec have worked together on a project to tape out a test chip to explore manufacturing and design-rule options for the interconnect on future 3nm processes.
ARM tools take aim at finFET layout, timing issues
ARM has launched a pair of tools designed to improve the density and performance of finFET designs that use the company's physical libraries.
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