Shifting to low-carbon generation for electricity would do much to cut the carbon footprint of semiconductor processes according to work shown at this year’s IEDM.
At IEDM, CEA-Leti described a process that avoids the thermal problems of implementing CMOS transistors in the metal stack using monolithic integration.
This year’s IEDM features a number of papers that seek to drive down the size and boost the performance of image sensors.
Vertical integration is one of the major focus areas at the upcoming IEDM conference, both in terms of transistors and the multiple channels that will go into them.
The 69th annual IEEE IEDM has issued a call for papers seeking the world’s best original work in all areas of microelectronics research and development.
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