Foundry

IP supplier CEVA has made a development platform intended to speed up the prototyping of IoT and similar devices based on its TeakLite-4 DSP core.

Menta has launched a family of off-the-shelf IP cores aimed at TSMC’s 28nm processes to provide reconfigurability for SoCs.

Collaboration between ARM, TSMC and Synopsys reveals challenges of 10nm finFET design flows.

GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.

It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.

Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.

The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.

As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.