Foundry

October 22, 2015

Ceva builds DSP chip and board for IoT prototyping

IP supplier CEVA has made a development platform intended to speed up the prototyping of IoT and similar devices based on its TeakLite-4 DSP core.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , ,   |  Organizations: ,
September 14, 2015

Menta aims for TSMC 28nm with embedded FPGA cores

Menta has launched a family of off-the-shelf IP cores aimed at TSMC’s 28nm processes to provide reconfigurability for SoCs.
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations: ,
July 30, 2015

10nm flow reveals complexity of finFET design process

Collaboration between ARM, TSMC and Synopsys reveals challenges of 10nm finFET design flows.
Article  |  Topics: Conferences, Design to Silicon, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , ,
July 13, 2015

GlobalFoundries tunes 28nm for smaller, lower-power FD-SOI

GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
June 4, 2015

COMPUTEX 2015: Taiwan and mainland China face off in IoT platforms

It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.
March 17, 2015

China’s foundry outlook improves but still much to do

Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , , ,   |  Organizations: , , , ,
March 11, 2015

IoT and RF ‘to drive FD-SOI adoption’

The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , ,
March 11, 2015

Charting out the roadmap for FD-SOI

As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , ,

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