X-Fab adds galvanic isolation to CMOS process
X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
mixed signal
X-Fab introduces BCD-on-SOI at 110nm
X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.
Scaling power integrity analysis to match analog content in today’s designs
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
DVCon US and India chapters issue calls for submissions
The Bangalore conference has issued a last-minute call for panel proposals as technical paper submissions for the US edition get set to open next week.
Mentor as an evolving Siemens business: 3. Tanner EDA
Tanner's focus on AMS, MEMS and, now, the IoT-edge are making it even more ripe for integration with other Mentor tools.
With RF, power and MRAM, FD-SOI finds its role
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Synopsys integrates Helic’s EM tools to tighten margins on mixed-signal, analogue and RF SoCs
Better integration of EM modeling and analysis tools with Synopsys' Custom Compiler should enable tighter design margins
ARM puts Cortex-M3 into DesignStart program
ARM has expanded its DesignStart program by providing access to the Cortex-M3 as well as the M0 with no up-front licence fee.
Embedded World 2017 preview: Mentor Graphics
Three Mentor divisions - Embedded, PADS and Tanner EDA - will present their latest innovations during the conference and exhibition in Nuremberg next week.
Streamlining analog fault simulation
Analog fault simulation times have barely fallen for two decades but that is beginning to change.
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