Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
The Bangalore conference has issued a last-minute call for panel proposals as technical paper submissions for the US edition get set to open next week.
Tanner's focus on AMS, MEMS and, now, the IoT-edge are making it even more ripe for integration with other Mentor tools.
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Better integration of EM modeling and analysis tools with Synopsys' Custom Compiler should enable tighter design margins
ARM has expanded its DesignStart program by providing access to the Cortex-M3 as well as the M0 with no up-front licence fee.
Three Mentor divisions - Embedded, PADS and Tanner EDA - will present their latest innovations during the conference and exhibition in Nuremberg next week.
Analog fault simulation times have barely fallen for two decades but that is beginning to change.
What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
On-demand seminar explains how to exploit recently announced integration of Tanner and Eldo suites for sensor, IoT and other design types.
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