mixed signal

September 28, 2021

Scaling power integrity analysis to match analog content in today’s designs

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
July 4, 2019
DVCon US logo (Accellera)

DVCon US and India chapters issue calls for submissions

The Bangalore conference has issued a last-minute call for panel proposals as technical paper submissions for the US edition get set to open next week.
August 10, 2018

Mentor as an evolving Siemens business: 3. Tanner EDA

Tanner's focus on AMS, MEMS and, now, the IoT-edge are making it even more ripe for integration with other Mentor tools.
Article  |  Topics: Blog Topics  |  Tags: , , , , , , , , , ,   |  Organizations: , ,
July 12, 2018

With RF, power and MRAM, FD-SOI finds its role

FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: , , ,
January 5, 2018

Synopsys integrates Helic’s EM tools to tighten margins on mixed-signal, analogue and RF SoCs

Better integration of EM modeling and analysis tools with Synopsys' Custom Compiler should enable tighter design margins
Article  |  Topics: Blog - EDA, - Product  |  Tags: , ,   |  Organizations: ,
June 20, 2017

ARM puts Cortex-M3 into DesignStart program

ARM has expanded its DesignStart program by providing access to the Cortex-M3 as well as the M0 with no up-front licence fee.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations:
March 6, 2017

Embedded World 2017 preview: Mentor Graphics

Three Mentor divisions - Embedded, PADS and Tanner EDA - will present their latest innovations during the conference and exhibition in Nuremberg next week.
Article  |  Topics: Blog - EDA, Embedded, PCB  |  Tags: , , , , , , , ,   |  Organizations: , ,
February 22, 2017

Streamlining analog fault simulation

Analog fault simulation times have barely fallen for two decades but that is beginning to change.
January 18, 2017

Wafer expansion hits the buffers

What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: ,
November 11, 2016

Webinar focuses on Eldo RF verification of Tanner-based designs

On-demand seminar explains how to exploit recently announced integration of Tanner and Eldo suites for sensor, IoT and other design types.
Article  |  Topics: Blog - EDA, - Product, Verification  |  Tags: , , , , , , ,   |  Organizations: ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors