Chipmaker

April 25, 2023

Alps Alpine composes capacitance IC with Symphony

The company says the mixed-signal platform enabled a 5X improvement in verification productivity.
April 17, 2023

Semidynamics pushes configurability on RISC-V core for HPC

Processor IP company will incorporate custom instructions and other changes in its superscalar core, which includes a novel memory unit for sparse matrices.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: ,
April 13, 2023

Arm signs sub-2nm deal with Intel foundry operation

Intel Foundry Services has signed a deal with Arm that will see the two companies work on a program of system and design-technology co-optimization.
Article  |  Topics: Blog - IP  |  Tags: , , , , , ,   |  Organizations: ,
April 4, 2023

Curvilinear layout looks to wider adoption with mask speedups

Nvidia's move into software aimed at mask production and EDA looks to be part of a wider shift to improve yields.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
January 6, 2023

DVCon Europe best paper speeds up memory-controller tests

The winner of the best-paper award at DVCon Europe went to a team from Samsung based in India, describing their work on a reusable agent for testing the behavior of error-correcting memory circuits.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: ,
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
September 21, 2022

Nvidia proposes split-level link for chiplet interconnect

Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
September 15, 2022

Cadence extends AI to verification data with unified database

Cadence has brought the inputs for its AI-driven tools under the umbrella of a big-data collection platform and added functional verification to the list of products that use machine learning.
September 14, 2022

X-Fab to add 130nm SiGe with IHP deal

X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
August 31, 2022

Intel and partners join for RISC-V development push

Intel's Pathfinder for RISC-V is intended to boost the use of the architecture among a wider range of SoC design teams.

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