X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.
Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
Non-volatile alternatives to flash are finally moving out of the lab as Applied Materials launches production tools and Arm starts pushing MRAM.
The LightSuite Compiler produces designs based on Python descriptions and certifies them DRC-clean through hooks into the market-leading Calibre DFM suite.
GlobalFoundries has decided to put development of its 7nm process on the backburner and focus on its existing finFET and FD-SOI processes.
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
GlobalFoundries has introduced an embedded-MRAM option for its 22nm FD-SOI process: the 22FDX platform.
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