STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.
Arm and flexible-electronics specialist PragmatIC have demonstrated a 32bit processor implemented on a plastic substrate.
Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
Samsung described at VLSI Symposia how it has used two further forms of stacking to increase flash capacity.
Xilinx has reworked its Versal FPGA for edge-AI applications.
Questa suite of VIP adds PC and enterprise protocol as players prep designs for 2023 release.
Arm is reworking the DesignStart scheme it introduced several years, moving it under the umbrella of the broader Flexible Access program.
Unisantis aims to use its vertical transistor design in a novel form of DRAM that could improve density four-fold.
A case study describes how the RF and AMS specialist achieved efficiencies on a complex server DSP SoC project by running as-you-go DRC during place and route.
The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
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