Chipmaker

October 26, 2021

Arm accelerates library verification with Solido ML

Arm has used machine-learning tools supplied by the Solido group at Siemens Digital Industries Software to speed up IP validation runtime a thousand-fold compared to conventional statistical methods.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations: ,
October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , , ,
September 28, 2021

Scaling power integrity analysis to match analog content in today’s designs

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
September 24, 2021

Siemens brings chip-design flow to DARPA Toolbox Initiative

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: , , , ,
August 18, 2021

Overcome reset domain crossing challenges when using UPF

A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.
July 27, 2021

ST makes its first 200mm SiC wafers

STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
July 22, 2021

Arm shows off biggest flex processor so far

Arm and flexible-electronics specialist PragmatIC have demonstrated a 32bit processor implemented on a plastic substrate.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations:
July 19, 2021

Chiplet design raises big questions

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
Article  |  Topics: Blog - EDA, IP, PCB  |  Tags: , , , ,   |  Organizations: , , ,
June 16, 2021

Samsung moves further into 3D for denser flash

Samsung described at VLSI Symposia how it has used two further forms of stacking to increase flash capacity.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations:
June 9, 2021

Xilinx retools Versal for high-end edge AI

Xilinx has reworked its Versal FPGA for edge-AI applications.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , , ,   |  Organizations:

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