Chipmaker

Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like those used for the x86-based PC.

Arm has used machine-learning tools supplied by the Solido group at Siemens Digital Industries Software to speed up IP validation runtime a thousand-fold compared to conventional statistical methods.

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.

A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.

STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.

Arm and flexible-electronics specialist PragmatIC have demonstrated a 32bit processor implemented on a plastic substrate.

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.

Samsung described at VLSI Symposia how it has used two further forms of stacking to increase flash capacity.