Chipmaker

May 14, 2021

How MaxLinear cut physical verification time with in-design DRC

A case study describes how the RF and AMS specialist achieved efficiencies on a complex server DSP SoC project by running as-you-go DRC during place and route.
May 2, 2021

Alternative scaling approaches form VLSI 2021 technology highlights

The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
March 31, 2021

Arm looks to explore new realms for security with v9

Arm aims to introduce a novel security model in its upcoming v9 architecture along with further extensions for AI.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , ,   |  Organizations:
March 26, 2021

Siemens brings emulation and prototyping together in hardware-assisted verification

Siemens Digital Industries Software has launched the latest generation of its Veloce hardware-assisted verification systems with a product line that encompasses silicon virtual platform, hardware emulation, and prototyping support.
February 15, 2021

Getting a RISC-V embedded toolchain in place

A new white paper reviews the history of the open-source platform and provides guidance on best practice development for embedded.
Article  |  Topics: Blog - Embedded, - Next Generation Design, Standards  |  Tags: , ,   |  Organizations: ,
January 15, 2021

Copper’s future is troubled but it’s likely to stick around

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , , ,
December 21, 2020

Plasmonics may point way to faster interchip comms

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , ,   |  Organizations: ,
December 18, 2020

Backside metal defends against IR drop and side-channel attacks

Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.
December 17, 2020

Arm expands cloud migration on Arm-based machines at AWS

Arm is pushing more work onto Arm servers in the AWS cloud as it encourages EDA vendors to port their tools to the architecture.
Article  |  Topics: Blog - EDA, IP  |  Tags: ,   |  Organizations: ,
December 17, 2020

Macronix proposes 3D to breathe life back into NOR flash

At IEDM this year, Macronix showed how a 3D architecture may bring back NOR flash, which stopped scaling a decade ago.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:

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