Chipmaker

November 23, 2021

DAC 2021 Preview: Siemens EDA

DAC 2021 is looming and here is our first round up of a major EDA player's plans for the physical event in San Francisco.
November 5, 2021

UK consortium starts work on cryogenic CMOS

A £6.5m grant will fund the development of memories and other IP to improve the control of qubits in quantum computers.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
October 28, 2021

Emulation’s scheduling challenge

Emulation capacity and its scalability is a major issue for large SoC designs, said panelists at DVCon Europe.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: , , ,
October 27, 2021

DVCon Europe explores pitfalls and possibilities of AI for verification

In a panel at this week’s DVCon Europe, experts described a number of issues facing teams looking to incorporate machine learning in logic verification flows and why some of those efforts will not pay off while others succeed.
October 26, 2021

Arm SystemReady adjusts to compatibility issues

Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like those used for the x86-based PC.
Article  |  Topics: Blog - IP, PCB  |  Tags: , , , ,   |  Organizations:
October 26, 2021

Arm accelerates library verification with Solido ML

Arm has used machine-learning tools supplied by the Solido group at Siemens Digital Industries Software to speed up IP validation runtime a thousand-fold compared to conventional statistical methods.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations: ,
October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , , ,
September 28, 2021

Scaling power integrity analysis to match analog content in today’s designs

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
September 24, 2021

Siemens brings chip-design flow to DARPA Toolbox Initiative

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: , , , ,
August 18, 2021

Overcome reset domain crossing challenges when using UPF

A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.

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