Chipmaker

November 22, 2023

Arm gives Helium to low-end Cortex-M core

Arm has added machine-learning extensions and pointer-security instructions to its latest Cortex-M series core.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , ,   |  Organizations:
November 17, 2023

Siemens takes automotive digital twin to the AWS cloud

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , ,
November 3, 2023

Codasip pips Arm to commercial CHERI with RISC-V version

Codasip has put support for a set of instruction extensions intended to secure memory into its RISC-V core designs.
November 2, 2023

X-Fab adds galvanic isolation to CMOS process

X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
November 1, 2023

Companies partner for embeddable ReRAM

SureCore and Intrinsic have teamed up to provide a way to implement resistive random-access memory as an SoC-embeddable technology.
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations:
October 9, 2023

ITC 2023 preview: Siemens DIS

From tutorials to technical papers to special 'diamond' sessions, Tessent features large at ITC 2023.
Article  |  Topics: EDA - DFT  |  Tags:   |  Organizations: , , ,
October 5, 2023

Vertical integration expands at IEDM

Vertical integration is one of the major focus areas at the upcoming IEDM conference, both in terms of transistors and the multiple channels that will go into them.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
September 6, 2023

HPC and AI provide keynote focus at DVCon Europe

DVCon Europe has announced its two keynote presentations, focusing on energy-efficient high-performance computing and machine learning.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: ,
July 25, 2023

Verification Futures heads to the US in September

Tessolve is bringing its Verification Futures conference to the US with an event scheduled for mid-September.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , , ,
July 24, 2023

Backside power shows promise but more complex manufacturing

Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , ,

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