Chipmaker

November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
September 21, 2022

Nvidia proposes split-level link for chiplet interconnect

Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
September 15, 2022

Cadence extends AI to verification data with unified database

Cadence has brought the inputs for its AI-driven tools under the umbrella of a big-data collection platform and added functional verification to the list of products that use machine learning.
September 14, 2022

X-Fab to add 130nm SiGe with IHP deal

X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
August 31, 2022

Intel and partners join for RISC-V development push

Intel's Pathfinder for RISC-V is intended to boost the use of the architecture among a wider range of SoC design teams.
August 3, 2022

Accellera attempts to standardize CDC data

Accellera is on the first stage of setting up a working group to create a standard for exchanging information on clock domain crossing checks.
Article  |  Topics: Blog Topics, Blog - EDA, IP  |  Tags: , , ,   |  Organizations: ,
July 19, 2022

Teledyne pushes for optical for remote RF heads

Teledyne e2v has demonstrated a prototype optical link that the company believes could replace electrical signaling for remote RF heads.
Article  |  Topics: Blog - PCB  |  Tags: , , , ,   |  Organizations:
July 18, 2022

Open-source EDA grapples with the incentives issue

As the project that funded OpenRoad draws to a close, experts pondered its wider future at the 59th DAC.
June 30, 2022

Siemens and Nvidia aim to bring more virtual reality to digital twins

Siemens and Nvidia have agreed to work more closely together to drive the development of higher-fidelity digital twins.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , ,   |  Organizations: ,
June 29, 2022

SoC project uses eFPGA to extend DSP instructions

R&D multicore processor demonstrates programmable extensions for DSP.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: ,

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