Intel Foundry Services (IFS) has signed a deal with Arm that will see the two companies work on a program of system and design-technology co-optimization (DTCO) to try to ensure processors can take advantage of the gate-all-around architecture that will be deployed on the Intel 18A “1.8nm” technology and later nodes.
The collaboration will focus on mobile SoC designs first, but allows for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications.
“Intel’s collaboration with Arm will expand the market opportunity for IFS,” said Intel CEO Pat Gelsinger.
Rene Haas, CEO of Arm, added, “As the demands for compute and efficiency become increasingly complex, our industry must innovate on many new levels. Arm’s collaboration with Intel enables IFS as a critical foundry partner for our customers.”
Intel claimed its 18A process will deliver two key technologies. One is PowerVia for improved power delivery to the transistors and the RibbonFET GAA transistor design. IFS and Arm will develop a mobile reference design, allowing demonstration of the software and system knowledge for foundry customers. The program will go beyond process DTCO. Arm and IFS said they will work together to optimize the platforms for applications and software through as well as device packaging.