Nvidia proposes split-level link for chiplet interconnect
Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.
InFO interposer
TSMC demonstrates readiness for 3D-IC
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
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