X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.
Taking place in Chelmsford, MA on 27 August, the conference will feature user-authored papers, tutorials, a designer expo and keynotes from Cadence and IBM.
STMicroelectronics pushes on with FDSOI despite dissolution of ST-Ericcson joint venture that provided the lead customer for the process.
Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
View All Sponsors