February 10, 2022
Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
January 25, 2022
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
June 5, 2017
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.