EMI

January 25, 2022

Choose the right advanced packaging methodology for metal fill rules

Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.

Article | Topics: DFM, Blog - EDA, - Verification | Tags: 3D, advanced packaging, design rules, EMI, foundry, HBM, high-bandwidth memory, interposer, OSAT, power integrity, signal integrity | Organizations: Siemens EDA

January 14, 2016

DesignCon 2016 preview: Mentor Graphics

HyperLynx leads the way for vendor at DesignCon with booth demos and a day-long modeling and analysis seminar.

Article | Topics: Conferences, Blog - PCB | Tags: channel operating margins, DDR4, DesignCon, EMI, HMC, HyperLynx, novel memory, PAM4, power integrity, serdes, signal integrity | Organizations: Mentor Graphics

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