Tech Design Forum
Briefing
system technology co-optimization
system technology co-optimization
February 8, 2022
How digital twin evaluations optimize STCO-based design
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
Article | Topics:
Digital Twin
,
Blog - EDA
,
- Next Generation Design
,
Verification
| Tags:
2.5D
,
3D
,
abstraction
,
chiplet
,
HDAP
,
high density advanced packaging
,
interposer
,
mechanical analysis
,
power integrity
,
prototyping
,
STCO
,
system integrity
,
system technology co-optimization
,
thermal analysis
| Organizations:
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