2.5D-IC


December 18, 2014

Gary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL

The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
March 27, 2014

Intel and Altera extend foundry deal into interposer and full 3D

Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , ,   |  Organizations: , ,
November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
Article  |  Topics: Commentary, Conferences, Design to Silicon  |  Tags: , , , , ,   |  Organizations: ,
October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
November 16, 2012

3DIC – the advantages and the challenges of vertical integration

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.

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