assembly

February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.

Article | Topics: Verification | Tags: 2.5D, 3D, advanced packaging, assembly, chiplet, connectivity, foundry, integration, interposer, OSAT | Organizations: Siemens EDA

PLATINUM SPONSORS

Synopsys

Cadence Design Systems

Siemens EDA

View All Sponsors