assembly

June 20, 2023

Maximize manufacturing execution with HPC

Single-device tracking in the chiplet and multi-chip age needs a boost to deliver accuracy and greater production efficiency.

Article | Topics: DFM | Tags: assembly, design management, foundry, high performance computing, manufacturing execution system, MES, OSAT, packaging, test, traceability, track-and-trace | Organizations: Siemens EDA

February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.

Article | Topics: Verification | Tags: 2.5D, 3D, advanced packaging, assembly, chiplet, connectivity, foundry, integration, interposer, OSAT | Organizations: Siemens EDA

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