Amkor keeps question mark next to ‘full’ 3D-IC in 2016
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
interposer
DATE: Dark clouds gather over 3D integration, panelist tells conference
The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.
3D-IC integration prospects improving, say IEDM researchers
3D-IC integration techniques such as the use of TSVs, die stacking and interposers are unlikely to limit performance, according to research from TSMC and IBM
Synopsys builds 3D into tool portfolio
At the SNUG event this week, Synopsys is taking the wraps off its plans to support 3DIC, with updates to tools for physical design and verification.
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