System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
DesignCon 2017 takes place from Jan 31 to Feb 2 at the Santa Clara Convention Center with its usual focus on PCB design and implementation.
Mentor Graphics has added four new units to its PADS PCB family addressing increasing complexity in mainstream design.
HyperLynx from Mentor Graphics has moved into a new generation with more integrated features beyond PI and SI, and an easier to use GUI.
HyperLynx leads the way for vendor at DesignCon with booth demos and a day-long modeling and analysis seminar.
Automotive ethernet is the latest virtual reference design platform to be added to the family of models developed by Cadence to support its physical-layer IP cores.
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.
Cadence Design Systems has added LPDDR4 support and a topology explorer to its Sigrity lineup for signal and power integrity analysis of PCB-based designs, as well as more flexible licensing options.
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