April 6, 2023
Cadence Design Systems has expanded its use of machine learning for EDA into PCB design, joining a growing number of suppliers who have decided it is a sector that needs the AI treatment.
February 8, 2022
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
January 25, 2022
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
September 28, 2021
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
January 17, 2017
DesignCon 2017 takes place from Jan 31 to Feb 2 at the Santa Clara Convention Center with its usual focus on PCB design and implementation.
July 11, 2016
Mentor Graphics has added four new units to its PADS PCB family addressing increasing complexity in mainstream design.
April 4, 2016
HyperLynx from Mentor Graphics has moved into a new generation with more integrated features beyond PI and SI, and an easier to use GUI.
January 14, 2016
HyperLynx leads the way for vendor at DesignCon with booth demos and a day-long modeling and analysis seminar.
May 18, 2015
Automotive ethernet is the latest virtual reference design platform to be added to the family of models developed by Cadence to support its physical-layer IP cores.
March 24, 2015
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.