Cadence has linked several machine-learning approaches to build a tool that is designed to speed up the detection and diagnosis of on-chip power-integrity issues.
Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.
Cadence Design Systems has expanded its use of machine learning for EDA into PCB design, joining a growing number of suppliers who have decided it is a sector that needs the AI treatment.
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
DesignCon 2017 takes place from Jan 31 to Feb 2 at the Santa Clara Convention Center with its usual focus on PCB design and implementation.
Mentor Graphics has added four new units to its PADS PCB family addressing increasing complexity in mainstream design.
HyperLynx from Mentor Graphics has moved into a new generation with more integrated features beyond PI and SI, and an easier to use GUI.
HyperLynx leads the way for vendor at DesignCon with booth demos and a day-long modeling and analysis seminar.
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